產(chǎn)品展示
東莞供應(yīng)貝格斯HiFlow300P導(dǎo)熱絕緣硅膠片(現(xiàn)貨)
點(diǎn)擊次數(shù):91發(fā)布時間:2014/6/9 17:01:24

更新日期:2023/3/10 11:43:10
所 在 地:美洲
產(chǎn)品型號:HiFlow300P
優(yōu)質(zhì)供應(yīng)
詳細(xì)內(nèi)容
Bergquist Hi-Flow 300P導(dǎo)熱絕緣相變化材料
材料生產(chǎn)商:美國貝格斯(BERGQUIST)公司研發(fā)產(chǎn)品
Hi-Flow 300P可供規(guī)格:
厚度: 0.102mm 0.11mm 0.127mm
片材: 279.4 mm*304.8 mm
卷材: 279.4mm*76.2 m
持續(xù)使用溫度:150°
導(dǎo)熱系數(shù):1.6W/m-K
熱阻: 0.13C-in2/W(25psi)
背膠: 單面帶壓敏膠/不帶膠
顏色:綠色
Hi-Flow 300P應(yīng)用材料特性:
Hi-Flow 300P已被市場認(rèn)可了的聚酰亞胺基材,卓越的絕緣性能,卓越的抗切割性能
Hi-Flow® 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems.
Hi-Flow® 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition.The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.
Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application.
Hi-Flow 300P材料說明:
在CPU或功率元器件和散熱器之間作為導(dǎo)熱界面,Hi-Flow相變化材料是導(dǎo)熱膏很好的替代物。材料在特定的相變化溫度下從固態(tài)變成液態(tài),可以來確保總的界面潤濕,無溢出。與導(dǎo)熱膏比較,它無臟污,污染和麻煩。
Hi-Flow 300P典型應(yīng)用:
彈片/扣具安裝
獨(dú)立的功率半導(dǎo)體和模塊
Hi-Flow 300P技術(shù)優(yōu)勢分析:
和其他品牌同類產(chǎn)品相比較,Hi-Flow 300P在擊穿電壓和導(dǎo)熱性能上更勝一籌。該產(chǎn)品提供易撕離型紙,在大規(guī)模的人工裝配中特別便利。
Hi-Flow 300P典型應(yīng)用:
彈片/扣具安裝
獨(dú)立的功率半導(dǎo)體和模塊
Hi-Flow 300P技術(shù)優(yōu)勢分析:
和其他品牌同類產(chǎn)品相比較,Hi-Flow 300P在擊穿電壓和導(dǎo)熱性能上更勝一籌。該產(chǎn)品提供易撕離型紙,在大規(guī)模的人工裝配中特別便利。
Hi-Flow 300P典型應(yīng)用:
彈片/扣具安裝
獨(dú)立的功率半導(dǎo)體和模塊
Hi-Flow 300P技術(shù)優(yōu)勢分析:
和其他品牌同類產(chǎn)品相比較,Hi-Flow 300P在擊穿電壓和導(dǎo)熱性能上更勝一籌。該產(chǎn)品提供易撕離型紙,在大規(guī)模的人工裝配中特別便利。
Hi-Flow 300P典型應(yīng)用:
彈片/扣具安裝
獨(dú)立的功率半導(dǎo)體和模塊
Hi-Flow 300P技術(shù)優(yōu)勢分析:
和其他品牌同類產(chǎn)品相比較,Hi-Flow 300P在擊穿電壓和導(dǎo)熱性能上更勝一籌。該產(chǎn)品提供易撕離型紙,在大規(guī)模的人工裝配中特別便利。