Bergquist GapPadHC1000無(wú)基材間隙填充導(dǎo)熱材料

材料生產(chǎn)商：美國(guó)貝格斯（BERGQUIST）公司研發(fā)產(chǎn)品

GapPadHC1000可供規(guī)格：

厚度(Thickness)：10mil 15mil 20mil /228.6mm×76.2m

片材(Sheet)：8”×16”(203 mm×406 mm)

卷材(Roll)：9”×250’

導(dǎo)熱系數(shù)(Thermal Conductivity)：1.0W/m-k

基材(Reinfrcement Carrier)：玻璃纖維

膠面(Glue)：雙面自帶粘性

顏色(Color)：灰色

包裝(Pack)：美國(guó)原裝進(jìn)口包裝。

抗擊穿電壓(Dielectic Breakdown Voltage)（Vac）:＞5000

持續(xù)使用溫度（Continous Use Temp）：-60°~200°

GapPadHC1000應(yīng)用材料特性：

GapPadHC1000是無(wú)基材結(jié)構(gòu)，增強(qiáng)服貼性，服貼，低硬度，電氣絕緣

GapPadHC1000材料說(shuō)明：

GapPadHC1000是一款無(wú)基材的含有優(yōu)質(zhì)低模量填充復(fù)合物的導(dǎo)熱材料，在保留優(yōu)秀的導(dǎo)熱性能的同時(shí)，加工和裝配也非常方便，這材料雙面具有天然粘性，可以與相鄰的元器件表面進(jìn)行良好的貼合，大大減少了界面熱阻。

GapPadHC1000典型應(yīng)用：

計(jì)算機(jī)和外設(shè)、通訊設(shè)備、功率變換設(shè)備、RDRAM^TM存儲(chǔ)模塊/芯片級(jí)封裝、需要將熱量傳遞到機(jī)架、機(jī)箱或其它散熱裝置的場(chǎng)合

GapPadHC1000技術(shù)優(yōu)勢(shì)分析：

GapPadHC1000是一款常用的導(dǎo)熱絕緣材料。其廣泛用于中國(guó)大陸地區(qū)，因此材料本身的性能與質(zhì)量已經(jīng)得到市場(chǎng)的認(rèn)可。GapPadHC1000是一款性價(jià)比很好的導(dǎo)熱絕緣材料。導(dǎo)熱系數(shù)1.0W，出于導(dǎo)熱材料中中等水平，價(jià)格卻相對(duì)較低，并且有8種厚度可供用戶選擇。

Gap Pad® HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface ａnd electrical insulator between electronic components ａnd heat sinks.The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad® HC1000 is offered with removable protective liners on both sides of the material.Gap Pad® HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface ａnd electrical insulator between electronic components ａnd heat sinks.The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad® HC1000 is offered with removable protective liners on both sides of the material.Gap Pad® HC 1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface ａnd electrical insulator between electronic components ａnd heat sinks.The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. Gap Pad® HC1000 is offered with removable protective liners on both sides of the material.

通訊設(shè)備

需要將熱量傳遞到機(jī)架、機(jī)箱或其它散熱裝置的場(chǎng)合

RDRAM^TM存儲(chǔ)模塊

在不平整表面和散熱器之間作為導(dǎo)熱界面

DDR SDRAM存儲(chǔ)模塊

全緩沖內(nèi)存（FBDIMM）模塊