產品：FlatMaster100 for Wafer/Disk/Industry
Principle/原理:Grazing incidence Interferometer/斜入射干涉
Accuracy/精度:0.1μm/0.1微米 
Resolution/解析度:0.01μm/0.1微米
Part Size/尺寸范圍:12.5mm-100mm/12.5毫米-100毫米
Dynamic Range/動態(tài)測量范圍:30μm/30微米
Data Point/數(shù)據(jù)點:Up to 250,000/達250,000以上
Measurement Time/測量時間:〈5s per Measurement/單次測量小于5s
Standard Measurements/標準測量:Flatness/Line profile/Spherical radius
Optional Measurements/可選測量:Angularity/Parallelism/Perpendicularity
Data Analysis/數(shù)據(jù)分析:3D,topographic,yield,distribution
                       X,Y,circular and radial slice
                       Flat,spherical,and conical fit data
Materials/材料:Metals/金屬，Ceramics/陶瓷，Polymers/聚合體
Surface/表面:Precision ground,honed,polished and superfinished