產(chǎn)品展示
2D非接觸式測(cè)厚機(jī) YL-881
點(diǎn)擊次數(shù)：81發(fā)布時(shí)間：2010/7/13 17:32:37
更新日期：2010/7/13 17:32:37
所 在 地：
產(chǎn)品型號(hào)：
相關(guān)標(biāo)簽：
優(yōu)質(zhì)供應(yīng)
詳細(xì)內(nèi)容
2D非接觸式測(cè)厚機(jī) YL-881
Laser Vision Measurement 品管量測(cè)設(shè)備
產(chǎn)品特性（FEATURES）
◆使用Window’s視窗介面，中/英文化書面，操作簡(jiǎn)單。
◆手動(dòng)量測(cè)錫膏厚度
◆手動(dòng)測(cè)量長(zhǎng)、寬及兩錫膏間之距離（間距）
◆測(cè)量值可記錄存檔及列印
◆提供厚度分布統(tǒng)計(jì)圖表及X_Bar_R管制表
◆自動(dòng)計(jì)算制程能力指標(biāo)CP、CPK、CPM
◆可依不同生產(chǎn)線分別作記錄
◆可依基板厚度調(diào)整焦距
◆可做定時(shí)呼叫取樣
◆All operations are easy ａnd using Windows interface in Chinese/English version.
◆Survey thickness of tin solder by auto matica lly or manually.
◆Survey the length ａnd width manually,and the gap of tin solder.
◆Calculate the measure of area, the measure of cross-section ａnd the measure of volumn automatically.
◆All surveyed values can be recorded to a file ａnd be printed to a report.
◆Provide the diagrams of thickness distribution ａnd control diagrams of X_BAR_R.
◆Calculate man facture ability degree automatically（CP, CPK, CPM）
◆It can have proprietary record according to every different production ling.
◆It can adjust focus point in different thickness of PC boards.
◆It can be called to sample periodically.
適用（APPLECATION）
◆各式厚度量測(cè)數(shù)值取得統(tǒng)計(jì)分析
◆錫膏印刷機(jī)制程品管檢查
◆錫膏印刷厚度良性測(cè)量
◆錫膏印刷成型，尺寸量測(cè)檢查
◆提供其他物品測(cè)厚，測(cè)長(zhǎng)，量測(cè)檢查
◆Get the results of statistics ａnd analysis about all surveyed values in every thickness degree.
◆Inspect the quality of solder printing process.
◆Survey the thickness benignancy of tin solder
◆Measure the dimension of tin solder
◆Provide thickness ａnd dimension measurement function for other objects
功能（FUNCTION）
◆量測(cè)印刷錫膏厚度、長(zhǎng)度、高度、間距。
◆提供厚度分布數(shù)值參考。
◆提供各種統(tǒng)計(jì)分析圖表
X管制圖、 R管制圖、厚度列表
X平均值管制圖 單點(diǎn)列表
◆Surveying the thickness of printing tin solder, length ,height ａnd interval.
◆Provide the references of thickness distribution values.
◆Provide the analysis of different measure of cross-section.
◆Calculate the measure of area ａnd volumn automatically in object which to be surveyed.
◆Provide all diagrams of statistics ａnd analysis.
Provide X control Diagram, R Control Diagram
and Thickness List Diagram. Provide X Average
Control Diagram, Single Point List Diagram.
